Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu

Lee, T. Y. / Choi, W. J. / Tu, K. N. et al. | British Library Online Contents | 2002

Fatigue Damage Evaluation by Surface Feature for Sn-3.5Ag and Sn-0.7Cu Solders

Takahashi, T. / Hioki, S. / Shohji, I. et al. | British Library Online Contents | 2005

Wetting of microcrystalline and nanocrystalline Ni substrates by molten Sn-3.5Ag-0.7Cu alloy

Yang, J. / Shen, P. / Yin, Z. et al. | British Library Online Contents | 2010

Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

Yoon, J. W. / Jung, S. B. | British Library Online Contents | 2004

Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging

Yoon, J. W. / Lee, C. B. / Jung, S. B. | British Library Online Contents | 2004