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    Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

    New search for: Yoon, J. W.
    New search for: Jung, S. B.

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    Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

    New search for: Yoon, J. W.
    New search for: Jung, S. B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

    New search for: Yoon, J. W.
    New search for: Jung, S. B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

    Contributors:

    Yoon, J. W. (author) / Jung, S. B. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 39 ; 4211-4217

    Publication date:

    2004-01-01

    Size:

    7 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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