Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process

    New search for: Lee, D. H.
    New search for: Kwon, D. J.
    New search for: Hong, Y. K.
    New search for: Park, J. G.
    New search for: Pearce, T.
    New search for: Gao, Y.
    New search for: Tamaki, J.
    New search for: Kuriyagawa, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process

    New search for: Lee, D. H.
    New search for: Kwon, D. J.
    New search for: Hong, Y. K.
    New search for: Park, J. G.
    New search for: Pearce, T.
    New search for: Gao, Y.
    New search for: Tamaki, J.
    New search for: Kuriyagawa, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process

    New search for: Lee, D. H.
    New search for: Kwon, D. J.
    New search for: Hong, Y. K.
    New search for: Park, J. G.
    New search for: Pearce, T.
    New search for: Gao, Y.
    New search for: Tamaki, J.
    New search for: Kuriyagawa, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process

    Contributors:

    Lee, D. H. (author) / Kwon, D. J. (author) / Hong, Y. K. (author) / Park, J. G. (author) / Pearce, T. / Gao, Y. / Tamaki, J. / Kuriyagawa, T.

    Published in:

    Advances in Abrasive Technology VI ; 433-440

    KEY ENGINEERING MATERIALS

    Publication date:

    2004-01-01

    Size:

    8 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Effect of conditioner load on the polishing pad surface during chemical mechanical planarization process

    Shin, C. / Qin, H. / Hong, S. et al. | British Library Online Contents | 2016

    Inlaid Copper Multilevel Interconnections Using Planarization by Chemical-Mechanical Polishing

    Murarka, S. P. / Steigerwald, J. / Gutmann, R. J. | British Library Online Contents | 1993

    Study on planarization machining of sapphire wafer with soft-hard mixed abrasive through mechanical chemical polishing

    Xu, Yongchao / Lu, Jing / Xu, Xipeng | British Library Online Contents | 2016

    Advances in Chemical-Mechanical Planarization

    Singh, R. K. / Bajaj, R. | British Library Online Contents | 2002

    Study on planarization machining of sapphire wafer with soft-hard mixed abrasive through mechanical chemical polishing

    Xu, Yongchao / Lu, Jing / Xu, Xipeng | British Library Online Contents | 2016

    Back to top