Effect of conditioner load on the polishing pad surface during chemical mechanical planarization process: Fid-Bau Portal

Effect of conditioner load on the polishing pad surface during chemical mechanical planarization process

Shin, C. / Qin, H. / Hong, S. / Jeon, S. / Kulkarni, A. / Kim, T.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Effect of conditioner load on the polishing pad surface during chemical mechanical planarization process

Shin, C. / Qin, H. / Hong, S. / Jeon, S. / Kulkarni, A. / Kim, T.

Effect of conditioner load on the polishing pad surface during chemical mechanical planarization process

Shin, C. / Qin, H. / Hong, S. / Jeon, S. / Kulkarni, A. / Kim, T.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Effect of conditioner load on the polishing pad surface during chemical mechanical planarization process

Contributors:

Shin, C. (author) / Qin, H. (author) / Hong, S. (author) / Jeon, S. (author) / Kulkarni, A. (author) / Kim, T. (author)

Published in:

JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY ; 30 ; 5659-5665

Publication date:

2016-01-01

Size:

7 pages

ISSN:

1738-494X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621

Lee, D. H. / Kwon, D. J. / Hong, Y. K. et al. | British Library Online Contents | 2004

Inlaid Copper Multilevel Interconnections Using Planarization by Chemical-Mechanical Polishing

Murarka, S. P. / Steigerwald, J. / Gutmann, R. J. | British Library Online Contents | 1993

Effect of Conditioning Parameters on Surface Non-Uniformity of Polishing Pad in Chemical Mechanical Planarization

Qin, N. / Guo, D.M. / Kang, R.K. et al. | British Library Online Contents | 2009

Physical and Chemical Characteristics of the Ceramic Conditioner in Chemical Mechanical Planarization

Park, J.-Y. / Eom, D.-H. / Lee, S.-H. et al. | British Library Online Contents | 2003

Chemical mechanical planarization of copper pH effect

Du, T. / Desai, V. | British Library Online Contents | 2003