A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Trends in Wafer-Level Packaging of MEMS MEMS Packaging Solutions
Trends in Wafer-Level Packaging of MEMS MEMS Packaging Solutions
Trends in Wafer-Level Packaging of MEMS MEMS Packaging Solutions
Baert, K. (author) / De Moor, P. (author) / Tilmans, H. (author) / John, J. (author) / Witvrouw, A. (author) / Van Hoof, C. (author) / Beyne, E. (author)
ADVANCED PACKAGING ; 13 ; 25-28
2004-01-01
4 pages
Article (Journal)
English
DDC:
658.564
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