A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Experimental Studies of Through-Wafer Copper Interconnect in Wafer Level MEMS Packaging
Experimental Studies of Through-Wafer Copper Interconnect in Wafer Level MEMS Packaging
Experimental Studies of Through-Wafer Copper Interconnect in Wafer Level MEMS Packaging
Choa, S. H. (author) / Aliabadi, M. H. / Li, Q. / Li, L. / Buchholz, F.-G.
2006-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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