A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Low-Cost Wafer-Level Vacuum Packaging for MEMS
Low-Cost Wafer-Level Vacuum Packaging for MEMS
Low-Cost Wafer-Level Vacuum Packaging for MEMS
Gooch, R. (author) / Schimert, T. (author)
MRS BULLETIN- MATERIALS RESEARCH SOCIETY ; 28 ; 55-60
2003-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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