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A platform for research: civil engineering, architecture and urbanism
Reliability Analysis in Flip Chip Package under Thermal Cycling
Reliability Analysis in Flip Chip Package under Thermal Cycling
Reliability Analysis in Flip Chip Package under Thermal Cycling
Yeh, M. K. (author) / Tsai, C. Y. (author) / Kishimoto, K. / Kikuchi, M. / Shoji, T. / Saka, M.
2004-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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