A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test
Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test
Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test
Kim, D. G. (author) / Kim, J. W. (author) / Ha, S. S. (author) / Koo, J. M. (author) / Noh, B. I. (author) / Jung, S. B. (author) / Kim, H. / Hojo, J. / Lee, S. W.
2007-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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