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Flip Chip PBGAs Assess FPBGA Package Reliability

Chung, C. / Kutlu, Z. / Rajagopalan, S.

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Flip Chip PBGAs Assess FPBGA Package Reliability

Chung, C. / Kutlu, Z. / Rajagopalan, S.

Flip Chip PBGAs Assess FPBGA Package Reliability

Chung, C. / Kutlu, Z. / Rajagopalan, S.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Flip Chip PBGAs Assess FPBGA Package Reliability

Contributors:

Chung, C. (author) / Kutlu, Z. (author) / Rajagopalan, S. (author)

Published in:

ADVANCED PACKAGING ; 12 ; 35-38

Publication date:

2003-01-01

Size:

4 pages

ISSN:

1065-0555

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 658.564

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