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Gettering of Cu in Silicon Wafer by Using Cavitation Impacts

Kumano, H. / Soyama, H. / Saka, M.

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Gettering of Cu in Silicon Wafer by Using Cavitation Impacts

Kumano, H. / Soyama, H. / Saka, M.

Gettering of Cu in Silicon Wafer by Using Cavitation Impacts

Kumano, H. / Soyama, H. / Saka, M.

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Check availability in my library

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Document information

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Document information

Title:

Gettering of Cu in Silicon Wafer by Using Cavitation Impacts

Contributors:

Kumano, H. (author) / Soyama, H. (author) / Saka, M. (author) / Kishimoto, K. / Kikuchi, M. / Shoji, T. / Saka, M.

Published in:

Advances in Fracture and Failure Prevention ; 1409-1414

KEY ENGINEERING MATERIALS

Publication date:

2004-01-01

Size:

6 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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