Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM: Fid-Bau Portal

Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM

Kim, K.-S. / Yang, J.-M. / Yu, C.-H. / Jeon, H.-J.

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Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM

Kim, K.-S. / Yang, J.-M. / Yu, C.-H. / Jeon, H.-J.

Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM

Kim, K.-S. / Yang, J.-M. / Yu, C.-H. / Jeon, H.-J.

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Title:

Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM

Contributors:

Kim, K.-S. (author) / Yang, J.-M. (author) / Yu, C.-H. (author) / Jeon, H.-J. (author)

Published in:

MATERIALS TRANSACTIONS ; 45 ; 721-726

Publication date:

2004-01-01

Size:

6 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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