Formation of a Self-Interconnected Joint using a Low-Melting-Point Alloy Adhesive: Fid-Bau Portal

Formation of a Self-Interconnected Joint using a Low-Melting-Point Alloy Adhesive

Yasuda, K. / Kim, J.-M. / Yasuda, M. / Fujimoto, K.

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Formation of a Self-Interconnected Joint using a Low-Melting-Point Alloy Adhesive

Yasuda, K. / Kim, J.-M. / Yasuda, M. / Fujimoto, K.

Formation of a Self-Interconnected Joint using a Low-Melting-Point Alloy Adhesive

Yasuda, K. / Kim, J.-M. / Yasuda, M. / Fujimoto, K.

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Document information

Title:

Formation of a Self-Interconnected Joint using a Low-Melting-Point Alloy Adhesive

Contributors:

Yasuda, K. (author) / Kim, J.-M. (author) / Yasuda, M. (author) / Fujimoto, K. (author)

Published in:

MATERIALS TRANSACTIONS ; 45 ; 799-805

Publication date:

2004-01-01

Size:

7 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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