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Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler

Lee, J.W. / Lee, S.H. / Kim, J.-M. / Kim, J.H. / Lee, J.H.

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Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler

Lee, J.W. / Lee, S.H. / Kim, J.-M. / Kim, J.H. / Lee, J.H.

Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler

Lee, J.W. / Lee, S.H. / Kim, J.-M. / Kim, J.H. / Lee, J.H.

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Document information

Title:

Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler

Contributors:

Lee, J.W. (author) / Lee, S.H. (author) / Kim, J.-M. (author) / Kim, J.H. (author) / Lee, J.H. (author)

Published in:

MATERIALS TRANSACTIONS ; 49 ; 2572-2578

Publication date:

2008-01-01

Size:

7 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Yim, B.-S. / Kim, J.-M. / Jeon, S.-H. et al. | British Library Online Contents | 2009

Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers

Yim, B.-S. / Kim, J.-M. / Jeon, S.-H. et al. | British Library Online Contents | 2009

Influence of Resin Viscosity and Filler Volume on Self-Organized Micro Interconnection

Yasuda, K. / Ohta, K. / Fujimoto, K. | British Library Online Contents | 2006

Formation of a Self-Interconnected Joint using a Low-Melting-Point Alloy Adhesive

Yasuda, K. / Kim, J.-M. / Yasuda, M. et al. | British Library Online Contents | 2004

Characterization of Failure Behaviors in Anisotropic Conductive Interconnection

Kim, J.-W. / Kim, D.-G. / Koo, J.-M. et al. | British Library Online Contents | 2007