Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)

Yim, B.-S. / Oh, S.-H. / Kim, J. et al. | British Library Online Contents | 2012

New Electrically Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers

Kim, J.-M. / Yasuda, K. / Rito, M. et al. | British Library Online Contents | 2004

Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers

Yim, B.-S. / Lee, J.I. / Heo, Y. et al. | British Library Online Contents | 2012

Thermally conductive phenol formaldehyde composites filled with carbon fillers

Yan, D. / Li, X. / Jiang, Y. et al. | British Library Online Contents | 2014

Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers

Yim, B.-S. / Kim, J.-M. / Jeon, S.-H. et al. | British Library Online Contents | 2009