The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue: Fid-Bau Portal

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The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue

Henderson, D. W. / Woods, J. J. / Gosselin, T. A. / Bartelo, J. / King, D. E. / Korhonen, T. M. / Korhonen, M. A. / Lehman, L. P. / Cotts, E. J. / Kang, S. K.

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The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue

Henderson, D. W. / Woods, J. J. / Gosselin, T. A. / Bartelo, J. / King, D. E. / Korhonen, T. M. / Korhonen, M. A. / Lehman, L. P. / Cotts, E. J. / Kang, S. K.

The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue

Henderson, D. W. / Woods, J. J. / Gosselin, T. A. / Bartelo, J. / King, D. E. / Korhonen, T. M. / Korhonen, M. A. / Lehman, L. P. / Cotts, E. J. / Kang, S. K.

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Title:

The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue

Contributors:

Henderson, D. W. (author) / Woods, J. J. (author) / Gosselin, T. A. (author) / Bartelo, J. (author) / King, D. E. (author) / Korhonen, T. M. (author) / Korhonen, M. A. (author) / Lehman, L. P. (author) / Cotts, E. J. (author) / Kang, S. K. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 19 ; 1608-1612

Publication date:

2004-01-01

Size:

5 pages

ISSN:

Type of media:

Article (Journal)

Type of material:

Print

Language:

English

Classification:

© Metadata Copyright the British Library Board and other contributors. All rights reserved.

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