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    Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

    New search for: Jang, J.-W.
    New search for: De Silva, A. P.
    New search for: Lin, J.-K.
    New search for: Frear, D. R.

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    Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

    New search for: Jang, J.-W.
    New search for: De Silva, A. P.
    New search for: Lin, J.-K.
    New search for: Frear, D. R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

    New search for: Jang, J.-W.
    New search for: De Silva, A. P.
    New search for: Lin, J.-K.
    New search for: Frear, D. R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

    Contributors:

    Jang, J.-W. (author) / De Silva, A. P. (author) / Lin, J.-K. (author) / Frear, D. R. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 19 ; 1826-1834

    Publication date:

    2004-01-01

    Size:

    9 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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