Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration: Fid-Bau Portal

Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration

Liu, Y.-H. / Lin, K.-L.

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Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration

Liu, Y.-H. / Lin, K.-L.

Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration

Liu, Y.-H. / Lin, K.-L.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

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Document information

Title:

Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration

Contributors:

Liu, Y.-H. (author) / Lin, K.-L. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 20 ; 2184-2193

Publication date:

2005-01-01

Size:

10 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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