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A platform for research: civil engineering, architecture and urbanism
Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses
Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses
Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses
Ye, H. (author) / Basaran, C. (author) / Hopkins, D. C. (author)
INTERNATIONAL JOURNAL OF DAMAGE MECHANICS ; 15 ; 41-68
2006-01-01
28 pages
Article (Journal)
English
DDC:
620.1
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