Active joining of Ti-6Al-4V with electroplated Cu thin film: Fid-Bau Portal

Active joining of Ti-6Al-4V with electroplated Cu thin film

Li, J. H. / Lin, R. Y.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Active joining of Ti-6Al-4V with electroplated Cu thin film

Li, J. H. / Lin, R. Y.

Active joining of Ti-6Al-4V with electroplated Cu thin film

Li, J. H. / Lin, R. Y.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Active joining of Ti-6Al-4V with electroplated Cu thin film

Contributors:

Li, J. H. (author) / Lin, R. Y. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 381 ; 39-50

Publication date:

2004-01-01

Size:

12 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Baek, D. C. / Park, T. S. / Lee, S. B. | British Library Online Contents | 2004

Young's modulus of electroplated Ni thin film for MEMS applications

Luo, J. K. / Flewitt, A. J. / Spearing, S. M. et al. | British Library Online Contents | 2004

Atmospheric Corrosion of Electroplated Cu Thin Film in Moist Oxygen Environment

Fujimoto, S. / Umemura, H. / Shibata, T. et al. | British Library Conference Proceedings | 2006

Determination of mechanical properties of electroplated Ni thin film using the resonance method

Kim, S. H. | British Library Online Contents | 2007

Texture of Electroplated Copper Film under Biaxial Stress

Hong, B. / Jiang, C.-h. / Wang, X.-j. | British Library Online Contents | 2006