Locus of failure between a nanowire-coated leadframe and an epoxy-based molding compound: Fid-Bau Portal

Locus of failure between a nanowire-coated leadframe and an epoxy-based molding compound

Lee, H. Y. / Chang, Y. K.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Locus of failure between a nanowire-coated leadframe and an epoxy-based molding compound

Lee, H. Y. / Chang, Y. K.

Locus of failure between a nanowire-coated leadframe and an epoxy-based molding compound

Lee, H. Y. / Chang, Y. K.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Locus of failure between a nanowire-coated leadframe and an epoxy-based molding compound

Contributors:

Lee, H. Y. (author) / Chang, Y. K. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 382 ; 305-314

Publication date:

2004-01-01

Size:

10 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Lee, H. Y. / Park, G. S. | British Library Online Contents | 2002

Analysis of failure of nanobelt-coated copper-based leadframe/epoxy-based molding compound systems after pull-out test

Lee, H. Y. / Park, Y. B. / Jeon, I. et al. | British Library Online Contents | 2005

Failure paths of the Cu-based leadframe/EMC joints

Lee, H. Y. | British Library Online Contents | 2001

Plated leadframe metrology

Reilly, F. C. | British Library Online Contents | 2002

Adhesion Enhancement for Improved MSL: This segment describes a novel process enhances adhesion between molding compound and copper alloy leadframe substrates

Kurtz, O. / Wunderlich, C. / Ruther, R. et al. | British Library Online Contents | 2008