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Analysis of failure of nanobelt-coated copper-based leadframe/epoxy-based molding compound systems after pull-out test
Analysis of failure of nanobelt-coated copper-based leadframe/epoxy-based molding compound systems after pull-out test
Analysis of failure of nanobelt-coated copper-based leadframe/epoxy-based molding compound systems after pull-out test
Lee, H. Y. (author) / Park, Y. B. (author) / Jeon, I. (author) / Kim, Y. H. (author) / Chang, Y. K. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 405 ; 50-64
2005-01-01
15 pages
Article (Journal)
English
DDC:
620.11
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