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    Adhesion Enhancement for Improved MSL: This segment describes a novel process enhances adhesion between molding compound and copper alloy leadframe substrates

    New search for: Kurtz, O.
    New search for: Wunderlich, C.
    New search for: Ruther, R.
    New search for: Barthelmes, J.
    New search for: Neoh, D.-G.

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    Adhesion Enhancement for Improved MSL: This segment describes a novel process enhances adhesion between molding compound and copper alloy leadframe substrates

    New search for: Kurtz, O.
    New search for: Wunderlich, C.
    New search for: Ruther, R.
    New search for: Barthelmes, J.
    New search for: Neoh, D.-G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Adhesion Enhancement for Improved MSL: This segment describes a novel process enhances adhesion between molding compound and copper alloy leadframe substrates

    New search for: Kurtz, O.
    New search for: Wunderlich, C.
    New search for: Ruther, R.
    New search for: Barthelmes, J.
    New search for: Neoh, D.-G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Adhesion Enhancement for Improved MSL: This segment describes a novel process enhances adhesion between molding compound and copper alloy leadframe substrates

    Contributors:

    Kurtz, O. (author) / Wunderlich, C. (author) / Ruther, R. (author) / Barthelmes, J. (author) / Neoh, D.-G. (author)

    Published in:

    ADVANCED PACKAGING ; 17 ; 32-37

    Publication date:

    2008-01-01

    Size:

    6 pages

    ISSN:

    1065-0555

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  658.564

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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