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Investigation of vibration fracture behavior of Sn-Ag-Cu solders under resonance

Song, J.-M. / Li, F.-I. / Lui, T.-S. / Chen, L.-H.

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Investigation of vibration fracture behavior of Sn-Ag-Cu solders under resonance

Song, J.-M. / Li, F.-I. / Lui, T.-S. / Chen, L.-H.

Investigation of vibration fracture behavior of Sn-Ag-Cu solders under resonance

Song, J.-M. / Li, F.-I. / Lui, T.-S. / Chen, L.-H.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Investigation of vibration fracture behavior of Sn-Ag-Cu solders under resonance

Contributors:

Song, J.-M. (author) / Li, F.-I. (author) / Lui, T.-S. (author) / Chen, L.-H. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 19 ; 2665-2673

Publication date:

2004-01-01

Size:

9 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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