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A platform for research: civil engineering, architecture and urbanism
Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects
Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects
Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects
Li, D. (author) / Liu, C. (author) / Conway, P. P. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 391 ; 95-103
2005-01-01
9 pages
Article (Journal)
English
DDC:
620.11
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