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Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects
Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects
Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects
Li, D. (Autor:in) / Liu, C. (Autor:in) / Conway, P. P. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 391 ; 95-103
01.01.2005
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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