Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition (Express Regular Article)

Terashima, S. / Kariya, Y. / Tanaka, M. | British Library Online Contents | 2004

Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects

Kariya, Y. / Hosoi, T. / Kimura, T. et al. | British Library Online Contents | 2004

Current-induced interfacial reactions in Ni/Sn-3Ag-0.5Cu/Au/Pd(P)/Ni-P flip chip interconnect

Huang, M.L. / Ye, S. / Zhao, N. | British Library Online Contents | 2011

Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects

Li, D. / Liu, C. / Conway, P. P. | British Library Online Contents | 2005

Thermal Fatigue Life Prediction of ACF Bonding Flip Chip Packaging

Nam, H. W. | British Library Online Contents | 2006