Femtosecond versus nanosecond laser machining: comparison of induced stresses and structural changes in silicon wafers: Fid-Bau Portal

Femtosecond versus nanosecond laser machining: comparison of induced stresses and structural changes in silicon wafers

Amer, M. S. / El-Ashry, M. A. / Dosser, L. R. / Hix, K. E. / Maguire, J. F. / Irwin, B.

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Femtosecond versus nanosecond laser machining: comparison of induced stresses and structural changes in silicon wafers

Amer, M. S. / El-Ashry, M. A. / Dosser, L. R. / Hix, K. E. / Maguire, J. F. / Irwin, B.

Femtosecond versus nanosecond laser machining: comparison of induced stresses and structural changes in silicon wafers

Amer, M. S. / El-Ashry, M. A. / Dosser, L. R. / Hix, K. E. / Maguire, J. F. / Irwin, B.

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Document information

Title:

Femtosecond versus nanosecond laser machining: comparison of induced stresses and structural changes in silicon wafers

Contributors:

Amer, M. S. (author) / El-Ashry, M. A. (author) / Dosser, L. R. (author) / Hix, K. E. (author) / Maguire, J. F. (author) / Irwin, B. (author)

Published in:

APPLIED SURFACE SCIENCE ; 242 ; 162-167

Publication date:

2005-01-01

Size:

6 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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