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    Effect of passivation on stress relaxation in electroplated copper films

    New search for: Gan, D.
    New search for: Ho, P. S.
    New search for: Pang, Y.
    New search for: Huang, R.
    New search for: Leu, J.
    New search for: Maiz, J.
    New search for: Scherban, T.

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    Effect of passivation on stress relaxation in electroplated copper films

    New search for: Gan, D.
    New search for: Ho, P. S.
    New search for: Pang, Y.
    New search for: Huang, R.
    New search for: Leu, J.
    New search for: Maiz, J.
    New search for: Scherban, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of passivation on stress relaxation in electroplated copper films

    New search for: Gan, D.
    New search for: Ho, P. S.
    New search for: Pang, Y.
    New search for: Huang, R.
    New search for: Leu, J.
    New search for: Maiz, J.
    New search for: Scherban, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of passivation on stress relaxation in electroplated copper films

    Contributors:

    Gan, D. (author) / Ho, P. S. (author) / Pang, Y. (author) / Huang, R. (author) / Leu, J. (author) / Maiz, J. (author) / Scherban, T. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 21 ; 1512-1518

    Publication date:

    2006-01-01

    Size:

    7 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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