Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging: Fid-Bau Portal

Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging

Yoon, J.-W. / Chun, H.-S. / Jung, S.-B.

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Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging

Yoon, J.-W. / Chun, H.-S. / Jung, S.-B.

Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging

Yoon, J.-W. / Chun, H.-S. / Jung, S.-B.

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Order at Subito €

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Document information

Title:

Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging

Contributors:

Yoon, J.-W. (author) / Chun, H.-S. (author) / Jung, S.-B. (author)

Published in:

Special Issue on Lead-Free Soldering in Electronics III ; 2386-2393

MATERIALS TRANSACTIONS ; 46

Publication date:

2005-01-01

Size:

8 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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