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Laser decapsulation of molding compound from wafer level chip size package for solder reflowing

Qiu, H. / Zheng, H. Y. / Wang, X. C. / Lim, G. C.

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Laser decapsulation of molding compound from wafer level chip size package for solder reflowing

Qiu, H. / Zheng, H. Y. / Wang, X. C. / Lim, G. C.

Laser decapsulation of molding compound from wafer level chip size package for solder reflowing

Qiu, H. / Zheng, H. Y. / Wang, X. C. / Lim, G. C.

Access

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Laser decapsulation of molding compound from wafer level chip size package for solder reflowing

Contributors:

Qiu, H. (author) / Zheng, H. Y. (author) / Wang, X. C. (author) / Lim, G. C. (author)

Published in:

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING ; 8 ; 502-510

Publication date:

2005-01-01

Size:

9 pages

ISSN:

1369-8001

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.38152

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