Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint

    New search for: Shohji, I.
    New search for: Tohei, T.
    New search for: Yoshizawa, K.
    New search for: Nishimoto, M.
    New search for: Ogawa, Y.
    New search for: Kawano, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint

    New search for: Shohji, I.
    New search for: Tohei, T.
    New search for: Yoshizawa, K.
    New search for: Nishimoto, M.
    New search for: Ogawa, Y.
    New search for: Kawano, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint

    New search for: Shohji, I.
    New search for: Tohei, T.
    New search for: Yoshizawa, K.
    New search for: Nishimoto, M.
    New search for: Ogawa, Y.
    New search for: Kawano, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint

    Contributors:

    Shohji, I. (author) / Tohei, T. (author) / Yoshizawa, K. (author) / Nishimoto, M. (author) / Ogawa, Y. (author) / Kawano, T. (author)

    Published in:

    KEY ENGINEERING MATERIALS ; 385/387 ; 433-436

    Publication date:

    2008-01-01

    Size:

    4 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Analysis of Stress-Strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints

    Shohji, I. / Kobayashi, T. / Tohei, T. | British Library Online Contents | 2011

    Effects of package geometry on thermal fatigue life and microstructure of Sn-Ag-Cu solder joint

    Zeng, Z. / Li, X.B. / Li, L. et al. | British Library Online Contents | 2011

    Effect of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package

    Shohji, I. / Yoshizawa, K. / Nishimoto, M. et al. | British Library Online Contents | 2007

    Power cycling thermal fatigue of Sn-Pb solder joints on a chip scale package

    Towashiraporn, P. / Gall, K. / Subbarayan, G. et al. | British Library Online Contents | 2004

    Thermal fatigue life prediction of flip chip solder joints by fracture mechanics method

    Lau, J. H. | British Library Online Contents | 1993

    Back to top