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    Effect of temperature on the cure shrinkage measurement of non-conductive adhesives for flip chip interconnects

    New search for: Yu, H.
    New search for: Mhaisalkar, S. G.
    New search for: Wong, E. H.

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    Effect of temperature on the cure shrinkage measurement of non-conductive adhesives for flip chip interconnects

    New search for: Yu, H.
    New search for: Mhaisalkar, S. G.
    New search for: Wong, E. H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of temperature on the cure shrinkage measurement of non-conductive adhesives for flip chip interconnects

    New search for: Yu, H.
    New search for: Mhaisalkar, S. G.
    New search for: Wong, E. H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Effect of temperature on the cure shrinkage measurement of non-conductive adhesives for flip chip interconnects

    Contributors:

    Yu, H. (author) / Mhaisalkar, S. G. (author) / Wong, E. H. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 20 ; 1324-1329

    Publication date:

    2005-01-01

    Size:

    6 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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