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Orientation and Microstructure Dependence of Electromigration Damage in Damascene Cu Interconnect Lines
Orientation and Microstructure Dependence of Electromigration Damage in Damascene Cu Interconnect Lines
Orientation and Microstructure Dependence of Electromigration Damage in Damascene Cu Interconnect Lines
Mirpuri, K. K. (author) / Szpunar, J. A. (author)
MATERIALS SCIENCE FORUM ; 495/497 ; 1443-1448
2005-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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