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    High-Speed Bonding of Resin-Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for High-Frequency Chip Coil

    New search for: Shohji, I.
    New search for: Sakurai, T.
    New search for: Arai, S.
    New search for: Kim, Y.-J.
    New search for: Bae, D.-H.

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    High-Speed Bonding of Resin-Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for High-Frequency Chip Coil

    New search for: Shohji, I.
    New search for: Sakurai, T.
    New search for: Arai, S.
    New search for: Kim, Y.-J.
    New search for: Bae, D.-H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    High-Speed Bonding of Resin-Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for High-Frequency Chip Coil

    New search for: Shohji, I.
    New search for: Sakurai, T.
    New search for: Arai, S.
    New search for: Kim, Y.-J.
    New search for: Bae, D.-H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    High-Speed Bonding of Resin-Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for High-Frequency Chip Coil

    Contributors:

    Shohji, I. (author) / Sakurai, T. (author) / Arai, S. (author) / Kim, Y.-J. / Bae, D.-H.

    Published in:

    Advances in Fracture and Strength ; 2819-2824

    KEY ENGINEERING MATERIALS ; 297/300

    Publication date:

    2005-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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