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Deformation Behavior of Thick Aluminum Wire during Ultrasonic Bonding
Deformation Behavior of Thick Aluminum Wire during Ultrasonic Bonding
Deformation Behavior of Thick Aluminum Wire during Ultrasonic Bonding
Maeda, M. (author) / Yoneshima, Y. (author) / Kitamura, H. (author) / Yamane, K. (author) / Takahashi, Y. (author)
MATERIALS TRANSACTIONS ; 54 ; 916-921
2013-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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