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High-Speed Bonding of Resin-Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for High-Frequency Chip Coil
High-Speed Bonding of Resin-Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for High-Frequency Chip Coil
High-Speed Bonding of Resin-Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for High-Frequency Chip Coil
Shohji, I. (Autor:in) / Sakurai, T. (Autor:in) / Arai, S. (Autor:in) / Kim, Y.-J. / Bae, D.-H.
01.01.2005
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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