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Geometry Sensitivity Analyses of Microstructures of IC Packages on Passivation Cracking

He, Y. T. / Li, F. / Shi, R. / Zhang, G. Q. / Ernst, L. J. / Zhang, J. / Song, Z. T.

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Geometry Sensitivity Analyses of Microstructures of IC Packages on Passivation Cracking

He, Y. T. / Li, F. / Shi, R. / Zhang, G. Q. / Ernst, L. J. / Zhang, J. / Song, Z. T.

Geometry Sensitivity Analyses of Microstructures of IC Packages on Passivation Cracking

He, Y. T. / Li, F. / Shi, R. / Zhang, G. Q. / Ernst, L. J. / Zhang, J. / Song, Z. T.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Geometry Sensitivity Analyses of Microstructures of IC Packages on Passivation Cracking

Contributors:

He, Y. T. (author) / Li, F. (author) / Shi, R. (author) / Zhang, G. Q. (author) / Ernst, L. J. (author) / Zhang, J. (author) / Song, Z. T. (author) / Kim, Y.-J. / Bae, D.-H.

Published in:

Advances in Fracture and Strength ; 819-824

KEY ENGINEERING MATERIALS ; 297/300

Publication date:

2005-01-01

Size:

6 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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