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Passivation Cracking Analyses of Micro-Structures of IC Packages
Passivation Cracking Analyses of Micro-Structures of IC Packages
Passivation Cracking Analyses of Micro-Structures of IC Packages
He, Y. T. (author) / Li, H. P. (author) / Shi, R. (author) / Li, F. (author) / Zhang, G. Q. (author) / Ernst, L. J. (author) / Aliabadi, M. H. / Li, Q. / Li, L. / Buchholz, F.-G.
2006-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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