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Effect of Thickness on Grain Growth in Electrodeposited Copper Film by Cyclic Stressing
Effect of Thickness on Grain Growth in Electrodeposited Copper Film by Cyclic Stressing
Effect of Thickness on Grain Growth in Electrodeposited Copper Film by Cyclic Stressing
Iino, Y. (author) / Kim, Y.-J. / Bae, D.-H.
2005-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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