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Prediction of Residual Stress Distribution in Multi-Stacked Thin Film by Curvature Measurement and Iterative FEA
Prediction of Residual Stress Distribution in Multi-Stacked Thin Film by Curvature Measurement and Iterative FEA
Prediction of Residual Stress Distribution in Multi-Stacked Thin Film by Curvature Measurement and Iterative FEA
Choi, H. C. (author) / Park, J.-H. (author)
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY ; 19 ; 1065-1071
2005-01-01
7 pages
Article (Journal)
English
DDC:
621
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