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    Residual Stress Measurement of Porous Silicon Thin Film by Substrate Curvature Method

    New search for: Di, Y. X.
    New search for: Ji, X. H.
    New search for: Hu, M.
    New search for: Qin, Y. W.
    New search for: Chen, J. L.
    New search for: Lee, S.-B.
    New search for: Kim, Y.-J.

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    Residual Stress Measurement of Porous Silicon Thin Film by Substrate Curvature Method

    New search for: Di, Y. X.
    New search for: Ji, X. H.
    New search for: Hu, M.
    New search for: Qin, Y. W.
    New search for: Chen, J. L.
    New search for: Lee, S.-B.
    New search for: Kim, Y.-J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Residual Stress Measurement of Porous Silicon Thin Film by Substrate Curvature Method

    New search for: Di, Y. X.
    New search for: Ji, X. H.
    New search for: Hu, M.
    New search for: Qin, Y. W.
    New search for: Chen, J. L.
    New search for: Lee, S.-B.
    New search for: Kim, Y.-J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Residual Stress Measurement of Porous Silicon Thin Film by Substrate Curvature Method

    Contributors:

    Di, Y. X. (author) / Ji, X. H. (author) / Hu, M. (author) / Qin, Y. W. (author) / Chen, J. L. (author) / Lee, S.-B. / Kim, Y.-J.

    Published in:

    Experimental Mechanics in Nano and Biotechnology ; 223-226

    KEY ENGINEERING MATERIALS ; 326/328

    Publication date:

    2006-01-01

    Size:

    4 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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