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Reliability of Sn-Ag-Sb lead-free solder joints

Lee, H. T. / Lin, H. S. / Lee, C. S. / Chen, P. W.

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Reliability of Sn-Ag-Sb lead-free solder joints

Lee, H. T. / Lin, H. S. / Lee, C. S. / Chen, P. W.

Reliability of Sn-Ag-Sb lead-free solder joints

Lee, H. T. / Lin, H. S. / Lee, C. S. / Chen, P. W.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Reliability of Sn-Ag-Sb lead-free solder joints

Contributors:

Lee, H. T. (author) / Lin, H. S. (author) / Lee, C. S. (author) / Chen, P. W. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 407 ; 36-44

Publication date:

2005-01-01

Size:

9 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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