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Adhesion quantification methods for wafer bonding

Vallin, O. / Jonsson, K. / Lindberg, U.

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Adhesion quantification methods for wafer bonding

Vallin, O. / Jonsson, K. / Lindberg, U.

Adhesion quantification methods for wafer bonding

Vallin, O. / Jonsson, K. / Lindberg, U.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Adhesion quantification methods for wafer bonding

Contributors:

Vallin, O. (author) / Jonsson, K. (author) / Lindberg, U. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING R REPORTS -LAUSANNE- ; 50 ; 109-165

Publication date:

2005-01-01

Size:

57 pages

ISSN:

0927-796X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1 / 530

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