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Selection of Proper Fatigue Model for Flip Chip Package Reliability

Shin, Y. E. / Kim, Y. S. / Kim, H. I. / Kim, J. M. / Chang, K. H. / Farson, D. F.

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Selection of Proper Fatigue Model for Flip Chip Package Reliability

Shin, Y. E. / Kim, Y. S. / Kim, H. I. / Kim, J. M. / Chang, K. H. / Farson, D. F.

Selection of Proper Fatigue Model for Flip Chip Package Reliability

Shin, Y. E. / Kim, Y. S. / Kim, H. I. / Kim, J. M. / Chang, K. H. / Farson, D. F.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Selection of Proper Fatigue Model for Flip Chip Package Reliability

Contributors:

Shin, Y. E. (author) / Kim, Y. S. (author) / Kim, H. I. (author) / Kim, J. M. (author) / Chang, K. H. (author) / Farson, D. F. (author) / Naka, M. / Yamane, T.

Published in:

New Frontiers of Processing and Engineering in Advanced Materials ; 393-398

MATERIALS SCIENCE FORUM ; 502

Publication date:

2005-01-01

Size:

6 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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