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Solidification behavior of Sn-9Zn-xAg lead-free solder alloys

Tsai, Y. L. / Hwang, W. S.

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Solidification behavior of Sn-9Zn-xAg lead-free solder alloys

Tsai, Y. L. / Hwang, W. S.

Solidification behavior of Sn-9Zn-xAg lead-free solder alloys

Tsai, Y. L. / Hwang, W. S.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Solidification behavior of Sn-9Zn-xAg lead-free solder alloys

Contributors:

Tsai, Y. L. (author) / Hwang, W. S. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 413/414 ; 312-316

Publication date:

2005-01-01

Size:

5 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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