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    Solidification Mechanisms in the Sn-Cu-Ni Lead-Free Solder System

    New search for: Ventura, T.
    New search for: Cho, Y.H.
    New search for: Dahle, A.K.
    New search for: Nie, J.-F.
    New search for: Morton, A.

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    Solidification Mechanisms in the Sn-Cu-Ni Lead-Free Solder System

    New search for: Ventura, T.
    New search for: Cho, Y.H.
    New search for: Dahle, A.K.
    New search for: Nie, J.-F.
    New search for: Morton, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Solidification Mechanisms in the Sn-Cu-Ni Lead-Free Solder System

    New search for: Ventura, T.
    New search for: Cho, Y.H.
    New search for: Dahle, A.K.
    New search for: Nie, J.-F.
    New search for: Morton, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Solidification Mechanisms in the Sn-Cu-Ni Lead-Free Solder System

    Contributors:

    Ventura, T. (author) / Cho, Y.H. (author) / Dahle, A.K. (author) / Nie, J.-F. / Morton, A.

    Published in:

    PRICM7 PART 2 ; 1381-1384

    MATERIALS SCIENCE FORUM ; 654/656

    Publication date:

    2010-01-01

    Size:

    4 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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