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Flip Chip Solder Joint Failure Modes - High Electric Current Density Testing

Basaran, C. / Ye, H. / Hopkins, D. C. / Frear, D. / Lin, J. K.

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Flip Chip Solder Joint Failure Modes - High Electric Current Density Testing

Basaran, C. / Ye, H. / Hopkins, D. C. / Frear, D. / Lin, J. K.

Flip Chip Solder Joint Failure Modes - High Electric Current Density Testing

Basaran, C. / Ye, H. / Hopkins, D. C. / Frear, D. / Lin, J. K.

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Order at Subito €

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Document information

Title:

Flip Chip Solder Joint Failure Modes - High Electric Current Density Testing

Contributors:

Basaran, C. (author) / Ye, H. (author) / Hopkins, D. C. (author) / Frear, D. (author) / Lin, J. K. (author)

Published in:

ADVANCED PACKAGING ; 14 ; 15-19

Publication date:

2005-01-01

Size:

5 pages

ISSN:

1065-0555

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 658.564

Yang, D. | British Library Online Contents | 2008

Electromigration and thermomigration behavior of flip chip solder joints in high current density packages

Yang, D. | British Library Online Contents | 2008

Electromigration and thermomigration behavior of flip chip solder joints in high current density packages

Yang, D. / Chan, Y.C. / Wu, B.Y. et al. | British Library Online Contents | 2008

Electromigration and thermomigration behavior of flip chip solder joints in high current density packages

Yang, D. | British Library Online Contents | 2008

Mechanical Implications of High Current Densities in Flip-chip Solder Joints

Ye, H. / Basaran, C. / Hopkins, D. C. | British Library Online Contents | 2004