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Mechanical Implications of High Current Densities in Flip-chip Solder Joints
Mechanical Implications of High Current Densities in Flip-chip Solder Joints
Mechanical Implications of High Current Densities in Flip-chip Solder Joints
Ye, H. (author) / Basaran, C. (author) / Hopkins, D. C. (author)
INTERNATIONAL JOURNAL OF DAMAGE MECHANICS ; 13 ; 335-346
2004-01-01
12 pages
Article (Journal)
English
DDC:
620.1
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