Fluxless Sn-3.5 mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave: Fid-Bau Portal

Fluxless Sn-3.5 mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave

Hong, S.-M. / Kang, C.-S. / Jung, J.-P.

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Fluxless Sn-3.5 mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave

Hong, S.-M. / Kang, C.-S. / Jung, J.-P.

Fluxless Sn-3.5 mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave

Hong, S.-M. / Kang, C.-S. / Jung, J.-P.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Fluxless Sn-3.5 mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave

Contributors:

Hong, S.-M. (author) / Kang, C.-S. (author) / Jung, J.-P. (author)

Published in:

MATERIALS TRANSACTIONS ; 43 ; 1336-1340

Publication date:

2002-01-01

Size:

5 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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